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ASE, Greatek adds manpower as wire bonding lines in full capacity for 5G and 8K applications

Taiwan's IC packagers that includes ASE Technology and Greatek Electronics with running quad flat no-lead or QFN wire bonding lines at full capacity utilization.

The lines are mainly driven by strong demand for power management ICs for 5G and 8K applications from different customers.

Both companies adds more needed manpower to beef-up their workfornce for wirebonding lines.

QFN or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB.

QFN packaging in the communications market has been growing quickly as both companies will focus on customer demands.



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